Pfad

Card-Lamination (engl.)

Card-Lamination

  • Main Characteristics for card lamination   ( 6 Beiträge )
  • Lamination process   ( 11 Beiträge )
    During the lamination process, heat is supplied to the layers through the heating plates. Vacuum is useful for reducing possible air enclosures. The foils are heated under pressure and are welded. After completion of the welding process in all layers of the product pack, the pressure should be raised for cooling.
  • Basic Laminating Data   ( 1 Beitrag )

    PVC

    ABS

    PET

    PC

    Temperature [°C]

    130-160

    155

    130-160

    180-200

    Heating pressure [N/cm²]

    50-200

    150

    50-200

    200

    Cooling pressure [N/cm²]

    200-400

    300

    200-400

    400

    Heating time [min]

    15-20

    18-20

    15-20

    18-35

    By using additional adhesives between overlay/core and core/core, it is possible to reduce the heating time to almost half of the time used for welding without adhesive. Depending on the adhesive the pressure also may be changed to 2 times the value of standard welding.

  • Evaluating test parameters   ( 1 Beitrag )